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ACNP Record (derivato)ISSN Record
Periodico/Rivista*IEEE transactions on components and packaging technologies (Print)*IEEE transactions on components and packaging technologies (Print)
Altri TitoliTransactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologiesTransactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologies
Ente/Autore (Marc 710)Institute of Electrical and Electronics Engineers; Components, Packaging & Manufacturing Technology SocietyInstitute of Electrical and Electronics Engineers; Components, Packaging & Manufacturing Technology Society
EditoreInstitute of Electrical and Electronics EngineersInstitute of Electrical and Electronics Engineers
Luogo pubblicazioneNew York, NYNew York, NY
Da anno - Ad anno1999-20101999-2010
LinguaENGENG
PeriodicitàTRIMESTRALE: 4 numeri l'annoTRIMESTRALE: 4 numeri l'anno
PaeseUSUS
ISSN1521-33311521-3331
ISSN-L1521-33311521-3331
Codice Dewey621.317621.317
Cod. CNRP 00202404PD00455833
FonteACNPISSN
SupportoPrinted textPrinted text
Accesso Pubblico alla rivista:
http://ieeexplore.ieee.org/servlet/opac?punumber=6144
http://ieeexplore.ieee.org/servlet/opac?punumber=6144
Titoli collegati
GIA': *IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)
HA PER ALTRO SUPPORTO: *IEEE transactions on components and packaging technologies (Online)
POI: *IEEE transactions on components, packaging, and manufacturing technology (2011. Print)
GIA': *IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)
HA PER ALTRO SUPPORTO: *IEEE transactions on components and packaging technologies (Online)

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