| ACNP Record (derivato) | ISSN Record |
Periodico/Rivista | *IEEE transactions on components and packaging technologies (Print) | *IEEE transactions on components and packaging technologies (Print) |
Altri Titoli | Transactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologies | Transactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologies |
Ente/Autore (Marc 710) | Institute of Electrical and Electronics Engineers; Components, Packaging & Manufacturing Technology Society | Institute of Electrical and Electronics Engineers; Components, Packaging & Manufacturing Technology Society |
Editore | Institute of Electrical and Electronics Engineers | Institute of Electrical and Electronics Engineers |
Luogo pubblicazione | New York, NY | New York, NY |
Da anno - Ad anno | 1999-2010 | 1999-2010 |
Lingua | ENG | ENG |
Periodicità | TRIMESTRALE: 4 numeri l'anno | TRIMESTRALE: 4 numeri l'anno |
Paese | US | US |
ISSN | 1521-3331 | 1521-3331 |
ISSN-L | 1521-3331 | 1521-3331 |
Codice Dewey | 621.317 | 621.317 |
Cod. CNR | P 00202404 | PD00455833 |
Fonte | ACNP | ISSN |
Supporto | Printed text | Printed text |
Accesso Pubblico alla rivista: | http://ieeexplore.ieee.org/servlet/opac?punumber=6144 | http://ieeexplore.ieee.org/servlet/opac?punumber=6144 |
Titoli collegati | GIA': *IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)HA PER ALTRO SUPPORTO: *IEEE transactions on components and packaging technologies (Online)POI: *IEEE transactions on components, packaging, and manufacturing technology (2011. Print) | GIA': *IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)HA PER ALTRO SUPPORTO: *IEEE transactions on components and packaging technologies (Online) |